Technical Papers

Session 1: Best Paper Exchange

Technical Program Chair
Nagarajan Raghavan, SUTD, Singapore
Date/Time
Tuesday, 17 July 2018 / 11:40 hrs

Session 2: Case Studies on Fault Isolation

Chair
Christian Boit, TU Berlin, Germany
Date/Time
Tuesday, 17 July 2018 / 13:45 hrs

Session 3: Device Reliability

Chair
Mario Lanza, Soochow University, China
Date/Time
Tuesday, 17 July 2018 / 16:00 hrs

Session 4A: Case Studies on Physical Failure Analysis

Chair
Alan Street, ON Semiconductor, USA
Date/Time
Wednesday, 18 July 2018 / 08:00 hrs

Session 4B: Interconnect and Packaging Reliability

Chair
Lim Yeow Kheng, STATSChipPac, Singapore
Date/Time
Wednesday, 18 July 2018 / 08:00 hrs

Session 5A: Sample Prep, Metrology & Defect Characterization

Chair
Vinod Narang, AMD, Singapore
Date/Time
Wednesday, 18 July 2018 / 10:15 hrs

Session 5B: Package Level Failure Analysis

Chair
Jiann Min Chin, AMD Singapore
Date/Time
Wednesday, 18 July 2018 / 10:15 hrs

Session 6A: Advanced Physical Failure Analysis Techniques

Chair
Xing Wu, East China Normal University (ECNU), China
Date/Time
Wednesday, 18 July 2018 / 14:30 hrs

Session 6B: Package Level Failure Analysis

Chair
Lai-Seng Yeoh, Cypress Semiconductors, Malaysia
Date/Time
Wednesday, 18 July 2018 / 14:30 hrs

Session 7A: Advanced Electrical Fault Isolation Techniques

Chair
Philippe Perdu, CNES, France
Date/Time
Thursday, 19 July 2018 / 08:00 hrs

Session 7B: Device Reliability

Chair
Guoqiao Tao, Ampleon, Netherlands
Date/Time
Thursday, 19 July 2018 / 08:00 hrs

Session 8A: Case Studies on Physical Failure Analysis

Chair
Alan Street, ON Semiconductor, USA
Date/Time
Thursday, 19 July 2018 / 10:35 hrs

Session 8B: Device Reliability

Chair
Chadwin Young, UT Dallas, USA
Date/Time
Thursday, 19 July 2018 / 10:35 hrs

Session 9A: Advanced Electrical Fault Isolation Techniques

Chair
Venkat Krishnan Ravikumar, AMD, Singapore
Date/Time
Thursday, 19 July 2018 / 14:00 hrs

Session 9B: Sample Prep, Metrology & Defect Characterization

Chair
Vinod Narang, AMD, Singapore
Date/Time
Thursday, 19 July 2018 / 14:00 hrs

Session 10: Case Studies on Fault Isolation

Chair
Cheryl Hartfield, ZEISS, USA
Date/Time
Thursday, 19 July 2018 / 15:55 hrs

Session 11: Poster Session

Chair
Wardhana Sasangka, SMART Centre, Singapore
Co-Chair
Alfred Quah, GLOBALFOUNDRIES, Singapore
Date/Time
Wednesday, 18 July 2018 / 12:10 - 14:30 hrs