Tutorials

Tutorial A1: BEOL Reliability - From FinFETs to More-than-Moore Devices

Speaker
Dr. Jeff Gambino, ON Semiconductor , USA
Date/Time
Monday, 16 July 2018 / 08:30 – 10:30 hrs

Tutorial A2: FinFET and Post-FinFET Advanced Logic Device Reliability – A Review

Speaker
Prof. Aaron Thean, NUS, Singapore
Date/Time
Monday, 16 July 2018 / 10:45 – 12:45 hrs

Tutorial A3: Physical Analysis with TEM - Possibilities and Challenges

Speaker
Dr. Michel Bosman, IMRE, Singapore
Date/Time
Monday, 16 July 2018 / 14:00 – 16:00 hrs

Tutorial A4: Intrinsic Reliability Challenges for Non-Volatile Memory Technologies

Speaker
Dr. Robin Degraeve, IMEC , Belgium
Date/Time
Monday, 16 July 2018 / 16:15 – 18:15 hrs

Tutorial B1: Internet of Things and Low Power – Technology Concepts and Fault Isolation on Chip and System Level

Speaker
Prof. Christian Boit, TU Berlin, Germany
Date/Time
Monday, 16 July 2018 / 08:30 – 10:30 hrs

Tutorial B2: SiP, Packaged Stacked Devices and other Challenging 3D Assembly Analysis

Speaker
Dr. Philippe Perdu, CNES, France
Date/Time
Monday, 16 July 2018 / 10:45 – 12:45 hrs

Tutorial B3: Focused Ion Beam (FIB) Chip Circuit Edit Tutorial

Speaker
Dr. Steven B. Herschbein, GLOBALFOUNDRIES, USA
Date/Time
Monday, 16 July 2018 / 14:00 – 16:00 hrs

Tutorial B4: Defect localization using SEM based Current Imaging

Speaker
Dr. Michél Simon-Najasek, IMWS, Germany
Date/Time
Monday, 16 July 2018 / 16:15 – 18:15 hrs