Track 1: Emerging Topic in FA and Reliability
Chair
Dr. Francesco Puglisi- University of Modena, Italy
Co-Chair
Dr. Samuel Chef- Nanyang Technological University, Singapore
- Prof. Hong Yang
- The Institute of Microelectronics of Chinese Academy of Sciences, China
- Prof. Bin Gao
- Tsinghua University, China
- Dr. Changze Liu
- Huawei Technologies, China
- Prof. Navid Asadizanjani
- University of Florida, USA
- Dr. Erik Bury
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Dr. Wen Qiu
- Advanced Micro Devices, Singapore
- Prof. Chee Lip Gan
- Nanyang Technological University, Singapore
- Prof. Yiming Li
- National Chiao Tung University, Taiwan
- Prof. Umberto Celano
- University of Twente, Netherlands
- Prof. Tian-Li Wu
- National Chiao Tung University, Taiwan
- Prof. Nagarajan Raghavan
- Singapore University of Technology and Design, Singapore
Track 2: Sample Preparation
Chair
Dr. Erwin Hendarto- Silicon Labs, USA
Co-Chair
Mr. Vinod Narang- Advanced Micro Devices, Singapore
- Dr. Chih Hang Tung
- Taiwan Semiconductor Manufacturing Company, Taiwan
- Dr. Qing Liu
- Nanyang Technological University, Singapore
- Prof. Ralf Heiderhoff
- Bergische Universitat Wuppertal, Germany
- Prof. John Thong
- National University of Singapore, Singapore
- Dr. Jie Zhu
- GLOBALFOUNDRIES, Singapore
- Ms. Xinhua Zheng
- Nanyang Polytechnic, Singapore
- Dr. Ramesh Rao Nistala
- GLOBALFOUNDRIES, Singapore
- Mr. Roger Alvis
- Thermo Fisher Scientific, USA
- Dr. Vignesh Viswanathan
- Carl Zeiss, Singapore
- Dr.Sam Subramanian
- NXP Semiconductors, USA
- Dr. Ed Principe
- Synchrotron Research, Inc., USA
- Dr. Yongkai Zhou
- Carl Zeiss, Singapore
Track 3: Case Studies on Fault Isolation
Chair
Prof. Christian Boit- Technical University Berlin, Germany
Co-Chair
Dr. Alfred Quah- GLOBALFOUNDRIES, Singapore
- Dr. Hirotoshi Terada
- Hamamatsu HPK, Japan
- Dr. Zhongling Qian
- Infineon Technologies AG, Germany
- Dr. Joshua Kevek
- Intel Corporation, USA
- Dr. Zhigang Song
- International Business Machines (IBM), USA
- Mr. Brandon Scott
- Cirrus Logic, USA
- Ms Angeline Phoa
- Advanced Micro Devices, Singapore
- Mr. William Lo
- NVIDIA, USA
- Dr. Guillaume Bascoul
- The National Centre for Space Studies (CNES), France
- Dr. Samuel Chef
- Nanyang Technological University, Singapore
- Mr. Greg Johnson
- Carl Zeiss, USA
- Mr. Amit Jakati
- Samsung Electronics, USA
- Dr. ZhenXin Zhong
- Thermo Fisher Scientific, USA
Track 4: Case Studies on Physical Failure Analysis
Chair
Mr. Alan Street- AMS AG, USA
Co-Chair
Mr. Pik Kee Tan- GLOBALFOUNDRIES, Singapore
- Dr. James Lee
- Taiwan Semiconductor Manufacturing Company, Taiwan
- Mr. Soon huat Lim
- Advanced Micro Devices, Singapore
- Mr. Wilson Lee
- Qualcomm, Singapore
- Dr. Eckhard Langer
- GLOBALFOUNDRIES, Germany
- Ms. Ruby Vollrath
- Qualcomm, USA
- Prof. Olivier Latry
- University of Rouen Normandy, France
- Dr. Govindo J Syaranamual
- Thermo Fisher Scientific, Singapore
Track 5: Package Level Failure Analysis
Chair
Dr. Susan Li- Infineon Technologies AG, USA
Co-Chair
Mr. Jiann Min Chin- Advanced Micro Devices, Singapore
- Dr. Bernice Zee
- Advanced Micro Devices, Singapore
- Dr. Peter Jacob
- Swiss Federal Laboratories for Materials Science and Technology (EMPA), Switzerland
- Dr. Yan Li
- Intel Corporation, USA
- Mr. Em Julius Dela Cruz
- Maxim Integrated, Philippines
- Mr. Frank Altmann
- Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), Germany
- Dr. Liyi Li
- Intel Corporation, USA
- Dr. Shang Yang
- Advantest, Singapore
- Dr. Lihong Cao
- ASE Group - ASE (U.S.) INC., USA
- Dr. Jiaqi Tang
- JIACO Instruments, Netherlands
- Dr. Xueren Zhang
- Xilinx, Singapore
Track 6: Advanced Electrical Fault Isolation Techniques
Chair
Dr. Mike Bruce- Consultant, USA
Co-Chair
Mr. Kris Dickson- NXP Semiconductors USA
- Prof. Phillippe Perdu
- Consultant, France
- Dr. Chun-Cheng Tsao
- Thermo Fisher Scientific, Taiwan
- Dr. Franco Stellari
- International Business Machines (IBM), USA
- Dr. Szu Huat Goh
- GLOBALFOUNDRIES, Singapore
- Dr. William Lo
- NVIDIA, USA
- Mr. Venkat Krishnan Ravikumar
- Advanced Micro Devices, Singapore
- Mr. Joseph Caroselli
- Advanced Micro Devices, USA
- Mr. Vasanth Somasundaram
- Advanced Micro Devices, Singapore
- Dr. Keith Serrels
- NXP Semiconductors, USA
Track 7: Advanced Physical Failure Analysis Techniques
Chair
Dr. Christian Hobert- GLOBALFOUNDRIES, Germany
Co-Chair
Dr. Binghai Liu- Wintech Nano-Technology Services, Singapore
- Dr. Umberto Celano
- University of Twente, Netherlands
- Dr. Changqing Chen
- GLOBALFOUNDRIES, Singapore
- Dr. Michael DiBattista
- VarioScale, USA
- Dr. Jayhoon Chung
- Texas Instruments, USA
- Dr. Michel Bosman
- NUS A*STAR IMRE, Singapore
- Dr. Govindo J Syaranamual
- Thermo Fisher Scientific, Singapore
Track 8: Product Level Test and Diagnostic
Chair
Dr. Szu Huat Goh- GLOBALFOUNDRIES, Singapore
Co-Chair
Mr. Venkat Krishnan Ravikumar- Advanced Micro Devices, Singapore
- Mr. Jayant Dsouza
- Mentor Graphics, USA
- Mr. Gopinath Ranganathan
- Advanced Micro Devices, Singapore
- Dr. Yan Pan
- Advanced Micro Devices, USA
- Mr. Dakshi Srikanteswara
- Advanced Micro Devices, Singapore
Track 9: Transistor and NVM Device Reliability
Chair
Prof. Runsheng Wang- Peking University, China
Co-Chair
Prof. Felix Palumbo- National Technological University (UTN), Argentina
- Dr. James Stathis
- International Business Machines (IBM), USA
- Dr. Shubhakar Kalya
- Singapore University of Technology and Design, Singapore
- Prof. Mario Lanza
- King Abdullah University of Science and Technology (KAUST), Saudi Arabia
- Dr. Horng-Chih Lin
- National Chiao Tung University, Taiwan
- Prof. Nagarajan Raghavan
- Singapore University of Technology and Design, Singapore
- Prof. Jiezhi Chen
- Shandong University, China
- Dr. Stanislav Tyaginov
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Prof. Zheng Chai
- Xi'an Jiaotong University, China
- Dr. Narendra Parihar
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Dr. Danny Shum
- NXP Semiconductors, Singapore
- Dr. Subhali Subhechha
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Prof. Wei Zhang
- Liverpool John Moores University, UK
- Prof. Zhigang Ji
- Shanghai Jiao Tong University, China
- Dr. Xinfei Guo
- Univerity of Virginia, USA
- Prof. Tibor Grasser
- Vienna University of Technology, Austria
- Dr. Tam Lyn Tan
- GLOBALFOUNDRIES, Singapore
Track 10: ESD, Latch-up and Space Devices Reliability
Chair
Dr. Steven H. Voldman LLC- Consultant, USA
Co-Chair
Dr. Mingxiang Wang- Soochow University, China
- Dr. Natarajan Mahadeva Iyer
- Allegro Systems, USA
- Dr. Milova Paul
- GLOBALFOUNDRIES, Singapore
- Dr. Marko Simicic
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Dr. Harald Gossner
- Intel Corporation, USA
- Prof. Chun-Yu Lin
- National Taiwan Normal University (NTNU), Taiwan
- Dr. Chung Tah Chua
- Nanyang Technological University, SIngapore
Track 11: Interconnect and Packaging Reliability
Chair
Dr. Jeffrey Gambino- ON Semiconductor, USA
Co-Chair
Dr. Yeow Kheng Lim- STATSChipPAC, Singapore
- Dr. Kristof Croes
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Dr. Wenqi Zhang
- National Center for Advanced Packaging, China
- Prof. Hajdin Ceric
- Vienna University of Technology, Austria
- Dr. Christine Hau-Riege
- Qualcomm, USA
- Prof. Arief Suriadi Budiman
- BINUS University, Indonesia
- Dr. Sasi Kumar Tippabhotla
- A*STAR Institute of Microelectronics, Singapore
- Dr. Galor Zhang
- Facebook, USA
Track 12: Photonics Device (Display, lighting and Photovoltaic) Reliability and Failure Analysis
Chair
Dr. Yufeng Dai- Huawei Technologies, China
Co-Chair
Dr. Zhang Li- Huawei Technologies, China
- Prof. Massimo Vanzi
- Cagliari University, Italy
- Dr. Jin Wah Ronnie Teo
- SIMTECH A*STAR, Singapore
- Prof. Arief Suriadi Budiman
- BINUS University, Indonesia
Track 13: High Power Electronics/Wide Bandgap Device Reliability and Failure Analysis
Chair
Prof. Tian-Li Wu- National Chiao Tung University, Taiwan
Co-Chair
Dr. Wardhana A. Sasangka- Facebook, Ireland
- Prof. Wangran Wu
- Southeast University, China
- Prof. Bhawani Shankar
- Stanford University, USA
- Prof. Matteo Meneghini
- University of Padova, Italy
- Dr. Guoqiao Tao
- Ampleon, Netherlands
- Prof. Jinping Zhang
- University of Electronic Science and Technology of China, China
- Dr. Yu Gao
- Singapore - MIT Alliance for Research and Technology, Singapore
- Prof. Zhihong Liu
- Xidian University, China
- Dr. Matteo Borga
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Dr. Subramaniam Arulkumaran
- Nanyang Technological University, Singapore
Track 14: Reliability and Failure Analysis of 2D Nanoelectronics
Chair
Dr. Fei Hui- Technion Israel, Israel
Co-Chair
Dr. Alok Ranjan- Singapore University of Technology and Design, Singapore
- Dr. Wei Liang
- GLOBALFOUNDRIES, USA
- Prof. Kah Wee Ang
- National University of Singapore (NUS), Singapore
- Dr. Yuanyuan Shi
- Interuniversity Microelectronics Centre (IMEC), Belgium
- Prof. Yang Xu
- Zhejiang University, China
- Prof. Xing Wu
- East China Normal University, China
- Dr. Chundong Liang
- Micron Technology, USA
