Track 1: Emerging Topic in FA and Reliability

Chair
Dr. Francesco Puglisi
University of Modena, Italy
Co-Chair
Dr. Samuel Chef
Nanyang Technological University, Singapore
Prof. Hong Yang
The Institute of Microelectronics of Chinese Academy of Sciences, China
Prof. Bin Gao
Tsinghua University, China
Dr. Changze Liu
Huawei Technologies, China
Prof. Navid Asadizanjani
University of Florida, USA
Dr. Erik Bury
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Wen Qiu
Advanced Micro Devices, Singapore
Prof. Chee Lip Gan
Nanyang Technological University, Singapore
Prof. Yiming Li
National Chiao Tung University, Taiwan
Prof. Umberto Celano
University of Twente, Netherlands
Prof. Tian-Li Wu
National Chiao Tung University, Taiwan
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore

Track 2: Sample Preparation

Chair
Dr. Erwin Hendarto
Silicon Labs, USA
Co-Chair
Mr. Vinod Narang
Advanced Micro Devices, Singapore
Dr. Chih Hang Tung
Taiwan Semiconductor Manufacturing Company, Taiwan
Dr. Qing Liu
Nanyang Technological University, Singapore
Prof. Ralf Heiderhoff
Bergische Universitat Wuppertal, Germany
Prof. John Thong
National University of Singapore, Singapore
Dr. Jie Zhu
GLOBALFOUNDRIES, Singapore
Ms. Xinhua Zheng
Nanyang Polytechnic, Singapore
Dr. Ramesh Rao Nistala
GLOBALFOUNDRIES, Singapore
Mr. Roger Alvis
Thermo Fisher Scientific, USA
Dr. Vignesh Viswanathan
Carl Zeiss, Singapore
Dr.Sam Subramanian
NXP Semiconductors, USA
Dr. Ed Principe
Synchrotron Research, Inc., USA
Dr. Yongkai Zhou
Carl Zeiss, Singapore

Track 3: Case Studies on Fault Isolation

Chair
Prof. Christian Boit
Technical University Berlin, Germany
Co-Chair
Dr. Alfred Quah
GLOBALFOUNDRIES, Singapore
Dr. Hirotoshi Terada
Hamamatsu HPK, Japan
Dr. Zhongling Qian
Infineon Technologies AG, Germany
Dr. Joshua Kevek
Intel Corporation, USA
Dr. Zhigang Song
International Business Machines (IBM), USA
Mr. Brandon Scott
Cirrus Logic, USA
Ms Angeline Phoa
Advanced Micro Devices, Singapore
Mr. William Lo
NVIDIA, USA
Dr. Guillaume Bascoul
The National Centre for Space Studies (CNES), France
Dr. Samuel Chef
Nanyang Technological University, Singapore
Mr. Greg Johnson
Carl Zeiss, USA
Mr. Amit Jakati
Samsung Electronics, USA
Dr. ZhenXin Zhong
Thermo Fisher Scientific, USA

Track 4: Case Studies on Physical Failure Analysis

Chair
Mr. Alan Street
AMS AG, USA
Co-Chair
Mr. Pik Kee Tan
GLOBALFOUNDRIES, Singapore
Dr. James Lee
Taiwan Semiconductor Manufacturing Company, Taiwan
Mr. Soon huat Lim
Advanced Micro Devices, Singapore
Mr. Wilson Lee
Qualcomm, Singapore
Dr. Eckhard Langer
GLOBALFOUNDRIES, Germany
Ms. Ruby Vollrath
Qualcomm, USA
Prof. Olivier Latry
University of Rouen Normandy, France
Dr. Govindo J Syaranamual
Thermo Fisher Scientific, Singapore

Track 5: Package Level Failure Analysis

Chair
Dr. Susan Li
Infineon Technologies AG, USA
Co-Chair
Mr. Jiann Min Chin
Advanced Micro Devices, Singapore
Dr. Bernice Zee
Advanced Micro Devices, Singapore
Dr. Peter Jacob
Swiss Federal Laboratories for Materials Science and Technology (EMPA), Switzerland
Dr. Yan Li
Intel Corporation, USA
Mr. Em Julius Dela Cruz
Maxim Integrated, Philippines
Mr. Frank Altmann
Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), Germany
Dr. Liyi Li
Intel Corporation, USA
Dr. Shang Yang
Advantest, Singapore
Dr. Lihong Cao
ASE Group - ASE (U.S.) INC., USA
Dr. Jiaqi Tang
JIACO Instruments, Netherlands
Dr. Xueren Zhang
Xilinx, Singapore

Track 6: Advanced Electrical Fault Isolation Techniques

Chair
Dr. Mike Bruce
Consultant, USA
Co-Chair
Mr. Kris Dickson
NXP Semiconductors USA
Prof. Phillippe Perdu
Consultant, France
Dr. Chun-Cheng Tsao
Thermo Fisher Scientific, Taiwan
Dr. Franco Stellari
International Business Machines (IBM), USA
Dr. Szu Huat Goh
GLOBALFOUNDRIES, Singapore
Dr. William Lo
NVIDIA, USA
Mr. Venkat Krishnan Ravikumar
Advanced Micro Devices, Singapore
Mr. Joseph Caroselli
Advanced Micro Devices, USA
Mr. Vasanth Somasundaram
Advanced Micro Devices, Singapore
Dr. Keith Serrels
NXP Semiconductors, USA

Track 7: Advanced Physical Failure Analysis Techniques

Chair
Dr. Christian Hobert
GLOBALFOUNDRIES, Germany
Co-Chair
Dr. Binghai Liu
Wintech Nano-Technology Services, Singapore
Dr. Umberto Celano
University of Twente, Netherlands
Dr. Changqing Chen
GLOBALFOUNDRIES, Singapore
Dr. Michael DiBattista
VarioScale, USA
Dr. Jayhoon Chung
Texas Instruments, USA
Dr. Michel Bosman
NUS A*STAR IMRE, Singapore
Dr. Govindo J Syaranamual
Thermo Fisher Scientific, Singapore

Track 8: Product Level Test and Diagnostic

Chair
Dr. Szu Huat Goh
GLOBALFOUNDRIES, Singapore
Co-Chair
Mr. Venkat Krishnan Ravikumar
Advanced Micro Devices, Singapore
Mr. Jayant Dsouza
Mentor Graphics, USA
Mr. Gopinath Ranganathan
Advanced Micro Devices, Singapore
Dr. Yan Pan
Advanced Micro Devices, USA
Mr. Dakshi Srikanteswara
Advanced Micro Devices, Singapore

Track 9: Transistor and NVM Device Reliability

Chair
Prof. Runsheng Wang
Peking University, China
Co-Chair
Prof. Felix Palumbo
National Technological University (UTN), Argentina
Dr. James Stathis
International Business Machines (IBM), USA
Dr. Shubhakar Kalya
Singapore University of Technology and Design, Singapore
Prof. Mario Lanza
King Abdullah University of Science and Technology (KAUST), Saudi Arabia
Dr. Horng-Chih Lin
National Chiao Tung University, Taiwan
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore
Prof. Jiezhi Chen
Shandong University, China
Dr. Stanislav Tyaginov
Interuniversity Microelectronics Centre (IMEC), Belgium
Prof. Zheng Chai
Xi'an Jiaotong University, China
Dr. Narendra Parihar
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Danny Shum
NXP Semiconductors, Singapore
Dr. Subhali Subhechha
Interuniversity Microelectronics Centre (IMEC), Belgium
Prof. Wei Zhang
Liverpool John Moores University, UK
Prof. Zhigang Ji
Shanghai Jiao Tong University, China
Dr. Xinfei Guo
Univerity of Virginia, USA
Prof. Tibor Grasser
Vienna University of Technology, Austria
Dr. Tam Lyn Tan
GLOBALFOUNDRIES, Singapore

Track 10: ESD, Latch-up and Space Devices Reliability

Chair
Dr. Steven H. Voldman LLC
Consultant, USA
Co-Chair
Dr. Mingxiang Wang
Soochow University, China
Dr. Natarajan Mahadeva Iyer
Allegro Systems, USA
Dr. Milova Paul
GLOBALFOUNDRIES, Singapore
Dr. Marko Simicic
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Harald Gossner
Intel Corporation, USA
Prof. Chun-Yu Lin
National Taiwan Normal University (NTNU), Taiwan
Dr. Chung Tah Chua
Nanyang Technological University, SIngapore

Track 11: Interconnect and Packaging Reliability

Chair
Dr. Jeffrey Gambino
ON Semiconductor, USA
Co-Chair
Dr. Yeow Kheng Lim
STATSChipPAC, Singapore
Dr. Kristof Croes
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Wenqi Zhang
National Center for Advanced Packaging, China
Prof. Hajdin Ceric
Vienna University of Technology, Austria
Dr. Christine Hau-Riege
Qualcomm, USA
Prof. Arief Suriadi Budiman
BINUS University, Indonesia
Dr. Sasi Kumar Tippabhotla
A*STAR Institute of Microelectronics, Singapore
Dr. Galor Zhang
Facebook, USA

Track 12: Photonics Device (Display, lighting and Photovoltaic) Reliability and Failure Analysis

Chair
Dr. Yufeng Dai
Huawei Technologies, China
Co-Chair
Dr. Zhang Li
Huawei Technologies, China
Prof. Massimo Vanzi
Cagliari University, Italy
Dr. Jin Wah Ronnie Teo
SIMTECH A*STAR, Singapore
Prof. Arief Suriadi Budiman
BINUS University, Indonesia

Track 13: High Power Electronics/Wide Bandgap Device Reliability and Failure Analysis

Chair
Prof. Tian-Li Wu
National Chiao Tung University, Taiwan
Co-Chair
Dr. Wardhana A. Sasangka
Facebook, Ireland
Prof. Wangran Wu
Southeast University, China
Prof. Bhawani Shankar
Stanford University, USA
Prof. Matteo Meneghini
University of Padova, Italy
Dr. Guoqiao Tao
Ampleon, Netherlands
Prof. Jinping Zhang
University of Electronic Science and Technology of China, China
Dr. Yu Gao
Singapore - MIT Alliance for Research and Technology, China
Prof. Zhihong Liu
Xidian University, China
Dr. Matteo Borga
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Subramaniam Arulkumaran
Nanyang Technological University, Singapore

Track 14: Reliability and Failure Analysis of 2D Nanoelectronics

Chair
Dr. Fei Hui
Technion Israel, Israel
Co-Chair
Dr. Alok Ranjan
Singapore University of Technology and Design, Singapore
Dr. Wei Liang
GLOBALFOUNDRIES, USA
Prof. Kah Wee Ang
National University of Singapore (NUS), Singapore
Dr. Yuanyuan Shi
Interuniversity Microelectronics Centre (IMEC), Belgium
Prof. Yang Xu
Zhejiang University, China
Prof. Xing Wu
East China Normal University, China
Dr. Chundong Liang
Micron Technology, USA