Welcome to IPFA 2022 (HYBRID)
The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) is going hybrid with the live event coming to Marina Bay Sands, Singapore. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. Conference details and Call for Papers are as follows.
In-Person Conference : 18th – 20th July, 2022 Final Technical Program
Venue : Marina Bay Sands Expo and Convention Centre, Singapore
Level 4 Orchid – Melati Ballrooms – Level 4 Floor Plan
Virtual Conference : 3rd August – 2nd September 2022 (Whova) Virtual Technical Program
Click the button below to download our official conference app.
Click the image below to check out the photos of the In-Person Conference
Keynote Speakers
Keynote 1 : Towards CMOS/2D Hybrid Microchips
Speaker : Professor Mario Lanza
King Abdullah University of Science and Technology (KAUST), Saudi Arabia
Two-dimensional layered materials (2D-LMs) have outstanding physical, chemical and thermal properties that make them attractive for the fabrication of solid-state micro/nano-electronic devices and circuits. However, synthesizing high-quality 2D-LMs at the wafer scale is difficult, and integrating them in semiconductor production lines brings associated multiple challenges. Read More..
Keynote 2 : Reliable Electronics Skins?
Speaker : Professor Benjamin C.K. Tee
National University of Singapore, Singapore
The hyper-connected environment where humans, smart devices and robots live in synergy together could be realized within the next decade. Flexible, wearable sensors and systems are rapidly progressing in various possible use cases for health, consumer electronics and robotics. These skin-like devices require significant reliability performances in order to continue operating despite being Read More..