IPFA 2024

Advancing Technology for Humanity

IPFA 2024

IEEE 31st INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS

15 July 2024 – 18 July 2024

Marina Bay Sands Expo and Convention Centre, SINGAPORE

 

IPFA is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of failures in conventional, modern and new Semiconductor devices. The Technical Program Committee is inviting papers related, but not limited to, the following areas:

**请向下滚动到页面底部下载中文版本

Failure Analysis (FA) Tracks

FA1: Sample Preparation, Metrology and Defect Characterization: Device de-processing, Ion beam / TEM sample preparation, Metrology, Defect inspection, test chips

FA2: Electrical Fault Isolation Techniques: Photon, laser and electron beam based microscopy techniques, Static and Tester based techniques, Nanoprobing, AFP, EBAC/EBIC, next-generation backside power-rail analysis

FA3: Case Studies on Fault Isolation: Application of non-destructive workflows for defect localization. Die / Board / System-level electrical FA, Electrical characterization and nanoprobing

FA4: Physical Failure Analysis Techniques: Advanced methodologies in PFA, Advanced optical/Ion beam approaches, Plasma/Laser FIB, Spectroscopy (EDX / EELS / SIMS) techniques, Scanning probe microscopy, Circuit-edits, De-layering recipes and innovations, Tomography

FA5: Case Studies on Physical Failure Analysis: Die / Board / System-level physical FA, Workflows, defect exposure and characterization in silicon devices

FA6: Board, System and Product Level Failure Analysis: Design for manufacturing, Test diagnostics, Volume and statistical analysis, Construction Analysis, Reverse engineering. Embedded BIST and DFT test and diagnosis, defect-oriented testing, Test-to-Design feedback, mixed signal and analog tests, silicon failure debug by test and yield engineering methodologies

FA7: Package-Level Failure Analysis Techniques: Heterogenous integration, 2.5D/3D/SiP Package FA, backside power delivery network, non destructive analysis including Magnetic/acoustic/X-ray/Lock-in thermography/FTIR, TDR, EOTPR, material analysis

FA8: Case Studies on Package-Level Failure Analysis: Workflows in Packaging Failure Analysis, defect localization, exposure and characterization in packaging. Flipchips, Wire-bond, 2.5D/3D/SiP, wafer & panel level analysis

Reliability (REL) Tracks

REL1: Transistor and Emerging Electron Devices Reliability: Gate oxide/High-κ reliability, PBTI/NBTI, dopant effects, Self Heating in CMOS, GAA FET / RFSOI/ HBM/stack DRAM device reliability, Process and stress-induced reliability issues and variability, Non-volatile memory reliability – retention, endurance and read disturb in PCRAM, RRAM, STT-MRAM, Reliability and characterization of ferroelectric devices

REL2: Interconnect and Packaging Reliability: modeling and simulation TDDB dielectrics, Electro and stress migration, cracking, corrosion, and fatigue in bond pads, Reliability of 3DIC/ TSV, Heterogeneous Integration in SiP, Thermo-mechanical stress, Power, Wafer warpage, Wire and wafer bonding, chip-package interaction

REL3: ESD, Latchup, Reliability for Space and Nuclear Radiation: Component and system level ESD design: modeling and simulation, Neutron and alpha particle single event radiation, SER/SEU

Specialized Technologies (ST) Tracks

ST1: Hardware Security: Semi-Invasive and Invasive Analysis for attack of encryption system and countermeasure, Die-Level Reverse Engineering, Counterfeit Electronics Detection, Hardware Trojan localization. Click here for more details on ST1

ST2: AI for Failure Analysis and Reliability: Artificial intelligence (AI) for FA – fault detection, Visual / image analytics, Pattern recognition, Signal Processing, Machine learning for prognosis and reliability. Exploring reliability assessment and quantification for new applications (e.g. neuromorphic devices and AI accelerators). Click here for more details on ST2

ST3: High Power Electronics / Wide Bandgap Device Reliability & Failure Analysis: Reliability and Failure Analysis of devices and modules based on GaAs, GaN, SiC and Ga2O3 systems, Trap-related degradation,  Materials-related defect characterization, Process variability, III-V/Si integration and case studies of defects. Click here for more details on ST3

ST4: Optoelectronics, Thermal, and MEMs Devices Reliability and Failure Analysis: Reliability and failure analysis on display modules, lasers, LEDs, Solar cells (silicon, CdTe, CIGS, organic materials, multi-junction, perovskite), CMOS Image sensors, Photodetectors, Waveguides. Silicon Photonics, MEMS devices, Flexible electronics, Thermoelectrics. Click here for more details on ST4

 

SUBMISSION GUIDELINES

This year we have introduced direct full paper submissions. This helps in preponement of the paper mentoring phase allowing authors additional time to work on the recommendations of mentors. This selection specially benefits authors whose papers may have to undergo lengthy organizational/legal approvals.

Prospective authors are requested to submit an extended abstract (2 pages including figures) or a full manuscript (no less than 4 pages) of their previously unpublished and original research work. The abstract or full manuscript should include the following:

  1. Brief introduction to the background and motivation/objectives of the work.
  2. Experimental results, analysis, and discussion.
  3. Summary of the findings, highlighting their impact, novelty, and importance.
  4. Supporting figures, tables, and references.

All submissions must be in English. The materials in the paper must be original and unpublished. Please work on the abstract/full manuscript according to the provided template on the IPFA webpage. Only electronic submissions in PDF format will be accepted.

Please submit your abstract/full manuscript through the IPFA Website by 21 January 2024 5 February 2024. For further details, please contact the Technical Program Chair / Co-Chair at ipfa2024@softconf.com.

Authors of high quality papers presented at IPFA 2024 will be invited to submit an extended version of their work for a Special Issue in Elsevier Journal Microelectronic Engineering, (IF: 2.3, WoS: Q2). Expected publication in Feb-Mar 2025.

IMPORTANT DATES

Abstract or Full Manuscript Submission Deadline: Submission is closed

Notification of Abstract Acceptance: 18 March 2024

**IPFA 2024 & IEW-Asia 2024 share the same submission link