Paper Review Committee

Track 1: FA1 - Sample preparation, metrology and defect characterization

Chair
Erwin Hendarto
Silicon Labs
Co-Chair
Chung Tah Chua
Nanyang Technological University
Chris Kang
ThermoFisher Scientific
Dionaldo Zudhistira
Advanced Micro Devices
Ed Principe
Synchrotron Research, Inc.
Farisal Abdullah
ST Microelectronics
Ralf Heiderhoff
University of Wuppertal
Hui Chiang Teoh
Broadcom
John Thong
Singapore Institute of Technology
Sam Subramanian
NXP Semiconductors
Shaw Fong Wong
Intel Corporation
Vignesh Viswanathan
Raith Asia Ltd
Yongkai Zhou
ThermoFisher Scientific
Xinhua Zheng
Nanyang Polytechnic

Track 2: FA2 - Electrical Fault Isolation

Chair
Mike Bruce
Consultant
Co-Chair
Kristofor Dickson
NXP Semiconductors
Anil Matte
Intel Corporation
Baohua Niu
Intel Corporation
Chun-Cheng Tsao
ThermoFisher Scientific
Dayanand Nagalingam
Globalfoundries
Jason Christensen
Advanced Micro Devices
Keith Serrels
NXP Semiconductors
Joshua Kevek
Intel Corporation
Lesly Endrinal
Google
Vasanth Somasundaram
Advanced Micro Devices
Venkat Krishnan Ravikumar
Advanced Micro Devices
Venkatram Nalla
Checkpoint Technologies LLC
William Lo
NVIDIA

Track 3: FA3 - Case Studies Electrical Fault Isolation

Chair
Angeline Phoa
Advanced Micro Devices
Co-Chair
Chi Yung Ng
Intel Corporation
Abdul Aziz Omar
Infineon Technologies
A.C.T. Quah
Globalfoundries
Christian Burmer
Infineon Technologies
Dan Bockelman
Intel Corporation
Greg Johnson
ZEISS Microscopy
Hirotoshi Terada
Hamamatsu Photonics
Loke Sheng Foo
NXP Semiconductors
Zhigang Song
IBM

Track 4: FA4 - Physical Failure Analysis

Chair
Christian Hobert
Globalfoundries
Co-Chair
Umberto Celano
Arizona State University
Alok Ranjan
Chalmers University of Technology
Changqing Chen
Globalfoundries
Binghai Liu
Wintech Nanotechlogy
Jayhoon Chung
Texas Instruments
Nazirul Izzat Mohd. Arifen
Texas Instruments
Pei Ying Lee
5W2H Consulting SDN BHD
Samuel Wei
Advanced Micro Devices

Track 5: FA5 - Case Studies Physical Failure Analysis

Chair
Vinod Narang
Advanced Micro Devices
Jong-shing Bow
Integrated Service Technology Inc.
James Lee
Taiwan Semiconductor Manufacturing Company
Jiann Min Chin
Advanced Micro Devices
Olivier Latry
Université de Rouen Normandie
Soon huat Lim
Advanced Micro Devices
Wilson Lee Cheng Hoe
Qualcomm
Haishu Zhang
Infineon Technologies

Track 6: FA6 - Board, System and Product Level Failure Analysis

Chair
Anoop Kalarikkal
Advanced Micro Devices
Co-Chair
Szuhuat Goh
Qualcomm
Gopinath Ranganathan
Advanced Micro Devices
Dakshi Srikanteswara
Advanced Micro Devices
Jayant DSouza
Siemens DISW
Yan Pan
Advanced Micro Devices
Rommel Estores
Onsemi
Anoop Kalarikkal
Advanced Micro Devices

Track 7: FA7 - Package level Failure Analysis

Chair
Susan Li
Infineon Technologies
Co-Chair
Frank Altmann
Fraunhofer Institute for Microstructure of Materials and Systems IMWS
Bernice Zee
Advanced Micro Devices
Jiaqi Tang
JIACO Instruments
Syahirah Mohammad-Zulkifli
Advanced Micro Devices
Wen Qiu
Advanced Micro Devices
Yang Shang
Advantest Singapore Pte

Track 8: FA8 - Case Studies Package level Failure Analysis

Chair
Yan Li
Samsung
Co-Chair
Foo Jie
Advanced Micro Devices
Cheryl Selvanayagam
Advanced Micro Devices
Chin Yung Lai
Infineon Technologies
Em Julius Dela Cruz
Analog Devices
Chee Kiang Lau
Infineon Technologies
Liyi Li
Southeast University
Sebastian Brand
Fraunhofer IMWS
Xueren Zhang
Advanced Micro Devices

Track 9: REL1 - Transistor and Emerging Electron Device Reliability

Chair
Mario Lanza
King Abdullah University of Science and Technology
Co-Chair
Nagarajan Raghavan
Singapore University of Technology and Design
Giovanna Mura
DIEE - University of Cagliari
Xinfei Guo
Shanghai Jiao Tong University
Horng-Chih Lin
National Chiao Tung University
Fei Hui
Zhengzhou University
Meng Chuan Lee
Intel Corporation
Narendra Parihar
Intel Corporation
Shubhakar Kalya
Singapore University of Technology and Design
Subhali Subhechha
IMEC
Wei Zhang
Liverpool John Moores University
Xing Wu
East China Normal University
Yuanyuan Shi
University of Science and Technology of China
Zheng Chai
Xi'an Jiaotong University
Zhigang Ji
Shanghai Jiao Tong University

Track 10: REL2 - Interconnect and Packaging Reliability

Chair
Jeffrey Gambino
Onsemi
Co-Chair
Yeow Kheng Lim
National University of Singapore
Hajdin Ceric
Institute for Microelectronics, TU Wien
Christine Hau-Riege
Qualcomm
Kristof Croes
IMEC
HAOHUI LONG
Huawei
Sasi Kumar Tippabhotla
Institute of Microelectronics, A*Star Research Entities
Woon Yik Yong
Advanced Micro Devices

Track 11: REL3 TRACK CHAIR - ESD, Latch-up, Reliability for Space and Nuclear

Chair
Michael Khazhinsky
Silicon Labs
Co-Chair
Nicolas Nolhier
LAAS-CNRS, University of Toulouse
Shih-Hung Chen
IMEC
Chanhee Jeon
Samsung
Chuan-Jane Chao
Richwave Technology Corp
Chun-Yu Lin
National Yang Ming Chiao Tung University
Harald Gossner
Intel Corporation
Marko Simicic
IMEC
Mingxiang Wang
Soochow University
Natarajan Mahadeva Iyer
Allegro Microsystems
Nakul Pande
Apple Inc.
Sagar Karalkar
GlobalFoundries
Tadashi Takahashi
Reliability Center for Electronic Components of Japan (RCJ)
Ted Kolasa
Northrop Grumman Space Systems
Teruo Suzuki
Socionext Inc.
Wei Liang
Intel Corporation

Track 12: ST1 - Hardware Security

Chair
Qing Liu
Nanyang Technological University
Co-Chair
Franck Courbon
Ethicronics Ltd.
Jean-Max Dutertre
Mines Saint-Etienne
ZhiHeng Huang
Sun Yat-sen University
Massimo Alioto
National University of Singapore
Navid Asadi
University of Florida
Sachin Taneja
Intel Corporation
Xiaomei Zeng
Nanyang Technological University

Track 13: ST2 - Artificial Intelligence for Failure Analysis and Reliability

Chair
Francesco Maria Puglisi
University of Modena and Reggio Emilia
Co-Chair
Konstantin Schekotihin
University Klagenfurt
Christian Hollerith
Infineon Technologies
Samuel Chef
Nanyang Technological University
Changze Liu
Huawei
Michael Kögel
Fraunhofer IMWS
Nathan Linarto
Advanced Micro Devices
FRANCO STELLARI
IBM
Shang Yi Lim
Advanced Micro Devices
Yiming Li
National Yang Ming Chiao Tung University

Track 14: ST3 - High Power, Wide Bandgap Device Reliability and Failure Analysis

Chair
Tian-Li Wu
National Yang Ming Chiao Tung University
Co-Chair
ming xue
Infineon Technologies
Meng-Chia Lee
Renesas
Nicola Modolo
Infineon Technologies
Bhawani Shankar
Stanford University
Guoqiao Tao
Ampleon
Jinping Zhang
University of Electronic Science and Technology of China
Zhihong LIU
Xidian University
Matteo Meneghini
University of Padova
Wangran Wu
Southeast University
Hongyu Yu
Southern University of Science and Technology
Zhongling Qian
Infineon Technologies

Track 15: ST4 - Optoelectronics, MEMS

Chair
Massimo Vanzi
CNR-IMM
Co-Chair
Pu Jing
JFS Laboratory Wuhan
Alessio Griffoni
DeLonghi Group
Alan Street
AMS Sensors USA
Jisheng Pan
IMRE
Kor Ying Tneh
AMS Osram
Huiping Li
Huawei
Zhihong Mai
Hubei Jiufengshan Laboratory
Markus Keidler
AMS Osram
P Susthitha Menon
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM)
Swee Tiam Tan
Kelip-kelip! Center of Excellence for Light Enabling Technologies, Xiamen University Malaysia

Track 16: International ESD Workshop (IEW)

Chair
Teruo Suzuki
Socionext Inc.
Eleonora Gevinti
ST Microelectronics
Guangyi Lu
HiSilicon
Kyongjin Hwang
GlobalFoundries
Lena Zeitlhoefler
Infineon Technologies
Marko Simicic
IMEC
MASANORI SAWADA
Hanwa Electronic Ind. Co. Ltd.
Mototsugu Okushima
Renesas
Chanhee Jeon
Samsung
Chuan-Jane Chao
Richwave Technology Corp
Tadashi Takahashi
Reliability Center for Electronic Components of Japan (RCJ)