Technology Showcase and Workshop

The Workshops and Exhibition Technology Showcase are back by popular demand. Come Join Us!

Save the date: 15 July 2024 (Monday)


  • TECHNICAL WORKSHOP: What to expect
    • Technical experts will discuss latest developments in the fields of package level failure analysis and Machine learning and novel analysis methodologies.
    • They will introduce new systems and analysis techniques to improve productivity and localize defects in ultimate VLSIs.
    • This event is open to IPFA 2024 registered participants only.
    • Take part into a 1 hour guided tour to get updated on the latest offers from the exhibitors of IPFA 2024.
    • First-Hand demo of exhibitor products, Free consults and exchange of contacts in a dedicated setting. Unique opportunity to discover the perfect tools or services to empower your team and company to achieve its goals. More than 20 exhibitors will be participating to this event.
    • Group discussion with like-minded folks and building networks within SG FA community.
    • This event is open to all and Admission is FREE! For the first 120 sign-up, you will receive your choice of door gift or complimentary MBS car park coupon from us upon registration.

Registration is required for both events. Please CLICK HERE to register!



Sponsored WORKSHOP A details: Package Level Failure Analysis

Time 1615-1645: The challenge of current distribution mapping with MOCI analysis. Presenter: Hamamatsu, Dr. Norimichi Chinone

Magnetic field imaging is one of attractive technique because of magnetic field’s penetrative nature. Hamamatsu has been working on magnetic field imaging technique, which we call it MOCI (Magneto-Optical Current Imaging). It was first presented at ISTFA almost 10 years ago. This technique demonstrated sensitivity of nT/Hz<sup>1/2</sup> with capability of detecting z-direction magnetic field only a few um above the sample surface with fast scanning speed. Despite this capability, MOCI has yet been accepted in FA community because of several reasons, for example, usability and limited spatial resolution. In last couple of years, SIL-cap-like device, which we call it MOCI-cap, and much faster scanning capability were developed addressing the usability challenge. On the other hand, spatial resolution is still a big challenge although some tips to enhance spatial resolution exists. In this presentation, we will review physics behind MOCI followed by system implementation in PHEMOS. Then recent progress on MOCI, including MOCI-cap and tips for spatial resolution enhancement, will be discussed. Addressing especially for spatial resolution, emerging technique utilizing NV-center will be also discussed for future applications.

Time 1645-1715: Leveraging nano-probing technology for semiconductor device characterization. Presenter: Infineon Penang, Dr. Yeoh Lai Seng

Nano-probing is an omnipresent technique widely used in precision semiconductor characterization and local fault isolation at transistor level. Despite of high-complexity and time-consuming, nano-probing can increase the failure analysis success rate and enhance the customer satisfaction. This workshop covers the fundamental of nano-probing concept, system hardware setup and applications. Various fault isolation techniques such as EBAC, EBIC, EBIRCH, EBIV and current imaging will be explained in details. Introduction about auto pre-alignment and user-defined macros in facilitating the nano-probing process will also be given. The powerful features of micro heating-cooling and C-V test for advanced-level analysis will be introduced. Besides that, some case studies related to unique failure modes will be presented.

Time 1715-1745: Streamlining Millimeter-Scale Semiconductor Failure Analysis: An Integrated Workflow with Plasma FIB-SEM, Laser Techniques, and Advanced FA Tools. Presenter: TESCAN GROUP, Lukas Hladik – Product Marketing Manager

This talk will introduce a synergistic workflow, incorporating plasma FIB technology and the addition of a high-speed laser ablation technique. This integration significantly accelerates the analysis process and enhances the precision of results. We will also unveil the latest update of large volume workflow for advanced packaging failure analysis, developed collaboratively with industrial partners in the European FA4.0 project. This update includes a new shared sample holder compatible with a range of defect localization instruments and the innovative software for automated sample holder alignment and ROI identification. Attendees will gain insights into the flexibility of this workflow through demonstrations on various challenging samples, including complex devices and non-conductive materials. The session will highlight how these advanced methodologies facilitate fast, artifact-free sample preparation, crucial for ultra-high-resolution SEM imaging and thorough failure root-cause analysis.

Sponsored WORKSHOP B details: Machine Learning and Novel Analysis Methodologies for Improved Productivity

Time 1615-1645: Artificial Intelligence Powered 3D X-ray Microscopy for Semiconductor Package Development and Failure Analysis. Presenter: ZEISS, Dr. Allen Gu

The evolution of semiconductor packaging has improved electronic device performance. However, challenges arise from the increasing size and complexity of these packages for traditional 3D X-ray microscopy (XRM) techniques. AI-powered computer vision techniques have significantly enhanced XRM workflows, improving image quality, resolution, and scan time over a large field of view. In an upcoming workshop, we will showcase these transformative methods and workflows, including high-resolution reconstruction powered by deep learning and novel reconstruction methods using multiscale data. Real-world IC package examples will demonstrate the effectiveness of these AI-powered workflows.

Time 1645-1715: ML with big data analysis needs the tremendous amount of EFA data. Presenter: Hamamatsu, Mr Masataka Ikesu

[EFA Automation]: Collecting and analyzing big EFA data is necessary for accuracy and efficiency improvement of failure analysis applying machine learning. However, conventional EFA equipment did not have an adequate function to meet the demand. Hamamatsu developed and released a system which sequentially accesses to dies on a wafer and automatically acquires various EFA results. This system has a potential that analyses of the data accumulated continuously expands range of information acquired by the EFA; for example, grasping tendency of failure occurrence at specific layout pattern.
[Deep defect detection]: Hamamatsu supplies “Dual PHEMOS-X” equipping looking down optics and looking up optics. This machine gives higher sensitivity to detect defects deep inside device because of double side access capability to device surface. Hamamatsu is also studying a new technique for this machine configuration and developing software for this technique. And the “Dual PHEMOS-X” is expected to be applied to progressing devices with three-dimensional structure.

Time 1715-1745: What is possible with new high resolution X-ray imaging source. Presenter: Excilium, Dr. Till Dreier

We present a technical review of current state the art of X-ray metrology for Failure analysis and Quality control of advanced packaging, chiplets and heterogenous integration. The presentation includes examples from interconnects, vias, bond wires and redistribution layers on System on chips (SoC), High bandwidth memory stacks with TSVs and micro bumps as well as going into components such as multi layer ceramic capacitors (MLCC). Besides going through application examples, we will go through key requirement of the X-ray system from X-ray source to detector and comparison of different technology platforms pros and cons and ways to improve resolution and measurement throughput.